NeSSI (New Sampling/Sensor Initiative) Pittcon 2001 Update

Below is a short summary on the NeSSI (New Sampling/Sensor Initiative) forum conducted March 7th, 2001 in New Orleans (concurrent to Pittcon 2001). The thrust of this forum was to examine mechanisms, and elimination of barriers, for the purpose of "electrifying" NeSSI. To that end various ways of providing power, signal and heating systems (including wireless) to the miniature, modular manifolds were presented and discussed. The agenda for the meeting is summarized in the file NeSSIPittcon_agenda.ppt

First off we would like to thank the 37 or so attendees for making this a worthwhile endeavor. Your comments and feedback helped make this forum a valuable exercise. Secondly we would like to thank Steve Doe and the folks at Parker-Hannifin for arranging conference room accommodations in the "Bacchus Room" at the Wyndham Hotel. Finally, and most importantly, we would like to thank and acknowledge our presenters who did a bang up job. These included Rick Ales, Frank Ruiz, Kelley Bell and John Crawford. Also special mention goes to John Wright from Fisher-Rosemount who had to do a bit of "pinch-hitting" at the last moment.

Attached are the presentations from the forum and a bit of a recap for each. We hope you find them informative.

NeSSI Vision - "Top Ten Shopping List",  Rob Dubois - Dow Chemical,
[Topten_NeSSI_v2.ppt ]

• End Users vision of a "Smart" miniature/modular sample system.
• An introduction to the Sensor Analytical Manager (SAM).

New Sampling/Sensor Initiative, Frank Ruiz - Parker-Hannifin
[Parker_NeSSI Presentation New Orleans.ppt]

• Four paths are demonstrated to connect to sensors on the miniature/modular manifolds.
• System/Component cost? How much is too much? How big is the market?
• A need to define "where the intelligence should be located?"
• A call for specifications to cover Pressure, Temperature, Flow, heat, materials and seals.

CPAC Communications Session, Rick Ales - Swagelok
[Swagelok_PittConSession.ppt]

• A 4-20 mA solution for sensor connectivity
•  ...and compared against a sensor bus connectivity model.

Sensor Component Requirements,  Kelley Bell - ABB Analytical
[ABB_NeSSI Pittcon2001.ppt]

• Safety issues including various Regulatory approvals for classified and electrical systems.
• Issues with hard-wired and wireless solutions.
• Special considerations required for the petrochemical industry.
• The need for European community and Far Eastern approvals.
• The need for a thermal barrier between electronic components and a heated substrate.

NeSSI Wireless Sensor/Actuator Networking, John Crawford - Crossbow Technology, Inc.
[Crossbow_Bluetooth_2.ppt]

• Introduction to the new wireless revolution - and specifically covering the "Bluetooth" effort.
• A comparison of wireless methodologies.
• A recap of Crossbow's capabilities with its I/O and Bluetooth system.

"Electrifying" NeSSI - Wireless to the Rescue?
[SAMDiagrams.ppt]

• Wireless provide yet another opportunity to simplify sampling systems (at least from a wiring point of view)
• Different potential wireless configurations at the substrate level identified including the concept of a wireless SAM
• Overall configurations at the system level identified

Applying Wireless SI/O Architecture to NeSSI, John Crawford - Crossbow Technology, Inc.
[Crossbow_NeSSI_2.ppt]

• Methods and scenarios to incorporate Crossbow's Bluetooth wireless offering with NeSSI.

A couple of key issues have emerged from the New Orleans forum, specifically:

1. We need to break the work out into various groups/teams and by doing so making this process more inclusive. This will provide an opportunity for End Users and other interested folks to get more actively involved - and hands-on - at this key juncture.
2. We need to define more clearly the functional specifications of the equipment required for the substrate. To these ends we will be organizing at least four 4 small sub-teams as follows:

TEAM 1. Existing/Adapting Technology (EATS)

• Collect/organize/review existing technology - that is currently available in order to "electrify" NeSSI. This will cover heating, signal transmission - both hardwired and wireless - as well as power.
• Determine intrinsic safe solution using existing technology for both actuators and sensors.
  • Organization Meeting: CPAC Sampling Focus Session week of May 7th - 10th, Seattle, WA
  • Completion Date: ISA 2001 September, Houston, TX
  • Team Leader: To be determined.

TEAM 2. Functional Analytical Specification (FAST)

• Develop functional, generic specifications for substrate mounted physical sensors including P, T, F, A.
• Define requirements of a smart sensor for a sample system
• Define both wireless and wired connectivity architectures
• Develop heating and cooling requirements and control specifications for both substrate and enclosure.
• Recommend materials of construction (seals, metals, plastics) for various chemicals and petrochemical service
  • Organizational meeting at ISA 2001 September, Houston, TX
  • Team Leader: ?
  • Final Product: Presentation/Paper by end of 1st quarter 2002.

TEAM 3.  Sensor Analytical Manager (SAM)

• Define the requirements needed for a sample system "brain" and a smart sample system.
• Define what generic functional applets are required for a standalone sample systems.
• Define the type of HMI required to interact with SAM. e.g. PDA, PC, cell, etc.
• Determine what steps can be taken to achieve development
• Determine what functionality is required to support "simple" lab-on-a-chip sensors
• Define connectivity to both the sample system and the larger network. (SAM as a "bridge")
  • Organizational meeting at ISA 2001 September, Houston, TX.
  • Team Leader: Rob Dubois
  • Final Product: Presentation/Paper by end of 1st quarter 2002

TEAM 4. X-Proof Mini-Power & Signal Wiring/Connector Solution (MINI-BUS)

• Produce a specification for both hardwired signal and power - USB like? - Ethernet TCP/IP? other?
• Identify potential manufacturers
• Work with certification agencies to determine issues
• Define plug and socket component "standards"
  • Organizational meeting at ISA 2001 September, Houston, TX
  • Team Leader: ?
  • Final Product: Specification in place. Paper/Presentation ISA 2002

Associated & "Possible" Future Teams

• Connectivity Team (associated with NeSSI)
  •  Team leader: Peter van Vuuren (in progress)
• Miniature/Modular Analytical Sensors (suitable for NeSSI)
  •  Team leader: to be determined

The tentative structure of the teams will be as follow: a team leader, a core working group composed of 3-4 individuals and possibly a group of supporting members. We have some team leaders in mind but are actively working on "recruiting" both leaders and the core working groups. Please let us know if you are interested in serving in any of these capacities. Our next steps and activities will be formulated at the next CPAC Meeting which will be held the week of May 7-10, 2001 in Seattle, WA. At that time we will develop a roadmap for what we see are the required next steps and activities for NeSSI. We will also further define the mandate of each of these little sub-teams and identify participants and structure.

Best regards,
Peter, Rob and Mel

Peter van Vuuren
ExxonMobil Chemical
4500 Bayway Drive/P.O. Box 4900, Baytown, TX 77522
Phone: (281) 834-2988 Cell: (281)380-3294
peter.vanvuuren@exxon.com

Rob Dubois
Dow Chemical
Postal Bag 16, B-158
Fort Saskatchewan, AB, Canada T8L 2P4
780-998-5630
rndubois@dow.com

Mel Koch
Center for Process Analytical Chemistry
160 Chemistry Library Building
University of Washington
Box 351700
Seattle, WA 98195-1700
Office: (206) 685-2326
FAX: (206) 543-6506